Cracking the Challenges of High-End Manufacturing Inspection: Do3think Unveils the Next-Generation Dual-Fiber Line Scan Camera

As the global manufacturing industry accelerates its transformation towards intelligence and precision, industrial vision inspection technology has become a core link in ensuring product quality. In fields such as PCB, FPC , semiconductor wafers, new energy batteries, and high-end 3C electronics, inspection accuracy is shifting from the micron level to the sub-micron level, and inspection speed is upgrading from low-speed to high-speed dynamic capabilities.

Take the semiconductor industry as an example. With the increasing precision requirements for wafer, chip, and substrate inspection, traditional industrial cameras, which suffer from insufficient resolution, limited line frequency, and weak interference resistance, are unable to meet the demands of the new generation of intelligent manufacturing.

Dual Technology Integration, Redefining Industry Standards

Against this backdrop, relying on 19 years of technical accumulation, DO3THINK, a leading enterprise in China’s industrial vision field, has launched the dual-fiber line scan camera DXL16K6C-H1N-F4.

According to reports, the newly released DXL16K6C-H1N-F4 line scan camera by Do3think features an industry-first combination of “TDI (Time Delay Integration) time-sharing strobe + time-sharing multi-channel flat-field correction” technologies. This combination offers higher sensitivity, better color reproduction, clearer images, and richer detail presentation, effectively solving existing industry pain points such as the difficulty in adapting to multiple light sources, the contradiction between high speed and high sensitivity, and poor stability in industrial environments. This innovation drives the industry from single-point breakthroughs to systematic and efficient collaborative development.

On this basis, the DXL16K6C-H1N-F4 achieves multi-dimensional breakthroughs. It not only supports 2/3/4-channel light source time-sharing triggering but also, in PCB inspection, can capture surface foreign objects and internal wiring defects simultaneously through alternating visible light and infrared light strobes using a single device.

Moreover, compared to the common 3.5μm pixels in the market, the 5μm large pixel global shutter equipped in the DXL16K6C-H1N-F4. combined with a 63.5dB dynamic range and 2-line TDI stacking technology, significantly enhances light sensitivity and further upgrades the detection rate of dark-field defects. It supports a resolution of 16384×6 and a maximum line frequency of 40KHz, meeting the high-speed inspection requirements of PCB boards. Additionally, features such as IP40 protection, low power consumption, and built-in optical modules further reduce hardware costs and improve industrial inspection efficiency.

Smart Scene Applications, Empowering Chinese Manufacturing

In terms of transmission, the DXL16K6C-H1N-F4 line scan cameras supports dual-fiber high-bandwidth transmission, which is immune to electromagnetic interference and can cover a transmission distance of over 300 meters. This capability has led to significant improvements in inspection accuracy and efficiency in manufacturing fields such as PCB, semiconductors, and high-end 3C electronics, providing key support for the upgrade of intelligent manufacturing.

DO3THINK

As a groundbreaking achievement in China’s domestic industrial vision field, Do3think has redefined the precision and boundaries of industrial inspection through its independently developed TDI time-shar

ing strobe + time-sharing multi-channel flat-field correction imaging technology. Compared to the commonly used single-line time-sharing strobe, TDI time-sharing strobe technology significantly increases the brightness of a single channel and reduces the brightness requirements for light sources. Furthermore, the time-sharing multi-channel flat-field correction function can correct each light source individually, making each channel’s image more uniform, improving detection accuracy, and reducing the rate of missed detections.

This technological upgrade not only highlights Do3think’s R&D gene of “technology-based enterprise” but also, through dual breakthroughs in product and application scenarios, showcases China’s innovative potential in the industrial vision field to the world, leading Chinese “Intelligent” manufacturing towards higher precision, higher reliability, and higher added value.