In today’s rapidly evolving wave of industrial automation, machine-vision technology has become an indispensable core technology for boosting production efficiency and guaranteeing product quality. As manufacturing moves toward ever greater precision, compactness, and intelligence, traditional machine-vision solutions increasingly reveal their limitations when confronted with stringent space constraints, complex environments, and extreme demands for inspection accuracy and speed. Especially in high-precision, miniaturized applications such as semiconductor packaging, LED die bonding, and precision assembly, achieving efficient and stable vision inspection within a confined footprint has become an urgent pain point for the industry.
Responding to market needs, Do3think has launched the 1 GigE lipstick-style industrial area-scan camera DSG135M. With its uniquely slender form factor and outstanding performance, it offers an innovative solution to these challenges, ushering machine-vision inspection into a new “micro” era.
Limitations of Traditional Approaches
Spatial Bottlenecks and Performance Challenges
Traditional industrial cameras often fall short in size, integration density, and environmental adaptability, making it difficult to meet the demands of modern smart manufacturing. In LED die bonders, for example, the highly integrated multi-nozzle system imposes severe space limitations, preventing conventional-sized cameras from being deployed at multiple points within the narrow reserved space. This directly restricts placement speed and flexibility. Moreover, in harsh industrial environments characterized by high temperatures and strong electromagnetic interference, traditional cameras may suffer from frame loss, overheating, and degraded stability, severely impacting line continuity and reliability. These limitations not only increase equipment complexity and maintenance costs but also hinder further improvements in production efficiency and product yield.
Product Technical Advantages
Extreme Miniaturization Paired with High Performance
Ultra-Narrow Mainboard & Slim Body
The Do3think DSG135M is an ultra-compact Gigabit Ethernet industrial camera whose design philosophy and technical features perfectly match the stringent requirements of smart-manufacturing vision solutions. Its core strengths are:
Slender Form Factor, Ultimate Spatial Adaptability The DSG135M employs a 15.8 mm ultra-narrow single-mainboard design; overall dimensions are only 20 mm × 18 mm × 94 mm, and weight is ≈ 48 g. The sensor board connects to the mainboard via an FPC cable supporting up to 300 mm, enabling flexible installation in extremely tight spaces.
Superior Image-Processing Capability The camera integrates a hardware image processor optimized for machine-vision algorithms (e.g., gray-scale matching, geometric matching). It effectively suppresses ambient light, reduces algorithmic computation time, and ensures more stable and accurate positioning, thereby boosting mechanical adaptability.
High Frame Rate & Global Shutter With 1 MP resolution, 120 fps frame rate, 2.7 µm pixel size, and global-shutter exposure, the camera guarantees real-time image capture in high-speed motion while eliminating motion blur—critical for “on-the-fly code reading” and “dynamic inspection.”
Industrial-Grade Stability & Environmental Adaptability Operating voltage: ultra-wide DC 9–28 V, power consumption < 2 W. Wide temperature range: –10 °C to 50 °C. Opto-isolated design ensures continuous, stable operation under high temperature and strong EMI, eliminating frame loss, overheating, or anomalies. Large on-board frame buffer ensures real-time, reliable transmission for multi-camera systems—up to 16 cameras simultaneously.
Strong Compatibility & Easy Integration Supports GigE Vision and GenICam standards, compatible with Windows XP 32-bit, Windows 7/8/8.1/10 (32/64-bit). Also supports mainstream vision software (HALCON, LabVIEW, OpenCV), greatly lowering integration difficulty and accelerating customer development and deployment.
In summary, the DSG135M lipstick camera solves multiple key problems plaguing today’s machine-vision applications: limited space, low image quality at high speed, poor stability, and inadequate image-processing efficiency and accuracy.
Application Case
LED Die Bonder
A leading Chinese LED placement-equipment manufacturer, renowned in LED manufacturing, selected Do3think’s lipstick camera to replace its legacy vision module during an equipment upgrade aimed at higher placement speed and system stability. Field tests confirmed that the camera significantly improved both operational efficiency and image-processing stability.
During implementation, the customer successfully integrated 8–12 lipstick cameras within a reserved width of only 20 mm, fully satisfying the multi-nozzle system’s installation and performance requirements. The machine achieved a peak placement speed of 70 000 chips/h while running continuously 7 × 24 hours at 40 °C under strong electromagnetic interference—without a single frame drop, overheating incident, or anomaly—demonstrating exceptional reliability and environmental resilience.
Multi-Industry Applications
Ideal Choice for Diverse Scenarios
Beyond LED placement, the DSG135M lipstick series has proven adaptable for mobile vision alignment & recognition, on-the-fly code reading, motion detection, and more, thanks to its compact footprint, high-speed stability, and multi-protocol support.
As smart manufacturing advances toward higher precision, speed, and flexibility, vision systems must not only “see clearly” but also “fit easily,” “react quickly,” and “run reliably.” The Do3think lipstick camera represents a breakthrough in machine vision. Its ultra-miniature design, outstanding performance, and industrial-grade stability effectively resolve the challenges traditional solutions face in precision manufacturing, making it the new-generation ideal choice for multi-camera deployments. Looking ahead, as industrial equipment’s demand for “lightweight + intelligent” vision solutions continues to grow, the Do3think lipstick camera is poised to deliver even greater value across a broader range of industries.
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