Do3Think Steals the Show at Vision China 2025

On October 28, Vision China 2025 Shenzhen Machine Vision Expo—an annual highlight for the machine-vision community—opened in grand fashion at Bao’an World Exhibition & Convention Center. The aisles were packed; the atmosphere electric. As one of the sector’s most dynamic innovators, Do3think arrived with a full-matrix portfolio of new products and solutions, giving every visitor a deep-dive experience of cutting-edge vision technology.

Hard-Core Solutions, Flagship Innovation
From the moment the doors opened, Do3think booth became a magnet for engineers, integrators and plant managers. Four vision sets—each one engineered to eliminate a real-world pain-point—took center stage.

Ultra-Small & Ultra-Light Split Camera

Built around the Do3Think SGC231M-H2, this kit photographs wafer-surface defects where space is measured in millimetres. Its feather-weight, miniature footprint removes spatial constraints and injects unprecedented flexibility into automated lines. Die-bonders, pick-and-place machines and wire-bonders in semiconductor fabs already regard it as the go-to vision module for tight quarters.

Dual-Optical 20G 8K Line Scan Camera

Powered by the DXL8K4M-H1N-F4 camera, the rig couples a 20 Gbps dual-optical interface with 8K resolution, multi-line high line-rate, TDI time-division strobe and multi-channel flat-field correction. The result: ultra-fast, ultra-precise imaging for lithium-battery film inspection and other high-speed, zero-tolerance applications.

65MP Color Large Area Scan Camera

The newest XGS-series 65 MP color global-shutter CMOS camera headlines this station. A 10 GigE fibre interface delivers 10 Gbps bandwidth across long cable runs with total EMI immunity. Four-channel time-division strobe slashes system cost by covering multiple exposure scenarios with one camera.

Small Optical Size 20MP High-Sensitivity Camera

The MGV2020-H2 packs 20 MP onto a 1/1.8-inch sensor in a 29 × 29 × 31.5 mm brick. It mates with miniature lenses, bolts straight onto robot arms, laughs at vibration, and ships today into 3C electronics, automotive and new-energy lines.

Smart Imaging Test Instruments for Bullet-Proof Quality Control

Sharing the booth, Do3Think’s test-box family—GP4pro high-speed phone test box, FA132 automotive-module aging box and DF108 lab-grade automotive burn-in box—quietly underlines every camera module’s reliability.

Take the GP4pro: its high-speed link and rock-solid power tree support I3C protocol; a four-channel MIPI equalizer pushes 1.8 Gsps/trio over 300 mm harnesses; 4 × 8 power rails with transient-regulation technology hold ripple to record lows; and a doubled data buffer guarantees zero dropped frames at maximum frame rate—covering the full journey from R&D to mass production.

Tech Talks, Forward-Looking Insights

Beyond the hardware, Do3Think took the stage at the concurrent Machine Vision Technology & Industrial Applications Forum. Market director Qiu Jian’s presentation, “Dual-Optical 16K Multi-Line TDI True-Color Camera in PCB Inspection,” walked a packed room through line-scan innovations that are pushing PCB defect detection into a new era. Real-world data and forward-looking analysis sparked lively Q&A and wide industry resonance.

Join Us—Gifts, Demos, Deep Dives

October 28-30, the Do3Think booth is running non-stop demos, one-on-one tech clinics and a stamp-collect game with premium giveaways. Drop by, handle the gear, grill our engineers and leave with both answers and souvenirs.

Vision Technology, Powering Intelligent Manufacturing

Vision China 2025 Shenzhen is more than a trade show; it is a catalyst for China’s smart-manufacturing leap. Through this platform Do3Think has once again demonstrated its resolve—and its proven ability—to empower every industry with reliable, innovative vision solutions. We will keep shipping stable, future-ready products that fuel the next wave of industrial upgrades.

The show runs through October 30. Find us at Hall 9, Booth 9D55, Shenzhen Bao’an World Exhibition & Convention Center. Let’s map the future of intelligent manufacturing—together.