Exhibition Ends, Engagement Extends | DO3THINK at IICIE 2026

From September 9 to 11, 2026, the IICIE 2026 (International Integrated Circuit Innovation Expo) was held at the Shenzhen World Exhibition & Convention Centre (Bao’an), alongside CIOE China Optical Fair and elexcon Shenzhen Electronics Fair.

At Booth 14A45, Hall 14, DO3THINK showcased its self-developed area scan cameras, line scan cameras, image grabbers, and semiconductor vision inspection solutions, demonstrating how advanced machine vision technologies can address real-world inspection challenges.

Six Vision Inspection Solutions on Display

At IICIE 2026, DO3THINK highlighted six vision inspection solutions covering several key processes, including semiconductor packaging, electronics manufacturing and precision component inspection.

🔹 Pre-Die-Bonding Die Inspection

This solution enables automatic wafer ID recognition during the semiconductor packaging process, replacing manual scanning and data entry to ensure accurate wafer traceability and process data binding while preventing data entry errors and omissions.

Inspection Items:

Surface and edge damage, foreign particles, pattern defects, and other morphological abnormalities.

Featured Camera:

SUC500M-H3 5MP Split-Type Industrial Camera

• Ultra-compact sensor head:20×20×18mm, only 11g
• USB 3.0 interface, up to 77 FPS
• Low-power design for stable and reliable operation
• Ideal for confined spaces and high-speed moving applications

🔹 LED Substrate Defect Inspection

This solution is designed for appearance quality control of LED substrates. It detects issues such as scratches, contamination, circuit misalignment, and glue dispensing defects, helping identify and reject defective substrates to ensure high yields in subsequent die bonding and packaging processes.

Inspection Items:

Open/short circuits, scratches, contamination, insufficient/excessive adhesive, dimensional deviations, and other surface defects.

Featured Camera:

DXL16K4MT-H1NF Dual-Port 16K TDI Monochrome Line Scan Camera

• 16K resolution with large 5 μm pixels for high SNR
• 20G dual-port platform, up to 140 kHz line rate
• TDI-based segmented strobe imaging + multi-channel flat-field correction
• Advanced camera monitoring functions
• Supports 1-to-4 single-fiber configuration

🔹 Optical Module Fiber End-Face Inspection Solution

This solution is designed for inspection during optical module manufacturing of optical modules, specifically targeting defects such as scratches, contamination, edge chipping, and pits on the end faces, to prevent defective products from entering assembly and testing processes and ensure the transmission performance and yield of optical modules.

Inspection Items:

Dust, oil, fingerprints, adhesive residue, scratches, pits, chips, collapse, and other microscopic defects.

Featured Camera:

MUV2008M-H2 21MP USB 3.0 Industrial Camera

Easy to integrate, stable and reliable

• 1-inch sensor, 21MP high resolution
• USB 3.0 interface for easy deployment
• Supports ISP functions including sharpening and noise reduction
• 12–24V wide-range power supply for enhanced compatibility
• Easy to integrate, stable and reliable

🔹 Component Automated Sorting

This solution is applied to automated sorting processes for semiconductors and miniature components. Through vision inspection, it performs product appearance detection, dimensional accuracy measurement, and appearance grading, replacing manual sorting, improving sorting accuracy and production efficiency, while eliminating human misjudgment and missed detection.

Inspection Items:

Dimensional measurement, molding voids, material shortage, edge chipping, cracks, scratches, dents, contamination, foreign particles, and other surface defects.

Featured Camera:

MGV137M-H2 / MGV518M-H2 GigE Area Scan Cameras

• 1.3MP / 5MP resolution, up to 93 FPS
• GigE interface for easy integration and multi-camera deployment
• Global shutter with strong resistance to light interference and blur-free high-speed imaging
• High SNR and wide dynamic range for excellent image quality

🔹 Wafer ID Recognition

This solution is used in semiconductor packaging processes for automatic wafer ID recognition, replacing manual scanning and entry to achieve precise wafer traceability and process data binding, while preventing incorrect or missed data entry.

Inspection Items:

Wafer ID recognition for accurate wafer traceability and process-data binding.

Featured Camera:

MUV600M-H 6MP Monochrome USB 3.0 Industrial Camera

• 6MP resolution for excellent image quality
• USB 3.0 interface, up to 60 FPS
• Up to 3s long exposure for clear imaging in low-light conditions
• Supports a wide range of ISP algorithms
• Ultra-low power consumption for stable operation

🔹 PCB-AVI

This solution utilizes white-light and infrared segmented strobe imaging to overcome the limitations of single-illumination inspection, enabling effective detection of hidden defects across PCB surfaces, substrates, and circuit layers.

Inspection Items:

PCB appearance defects, open circuits, short circuits, gaps, burrs, misalignment, contamination, and other defects in traces, pads, holes, solder masks, markings, and other areas.

Featured Camera:

DXL16K12CT-H1NF Dual-Port 16K TDI Color Line Scan Camera

• 16K resolution with large 5 μm large pixels for excellent image quality
• 20G dual-port platform, up to 40.5 kHz line rate with 4-TDI
• TDI-based segmented strobe imaging + multi-channel flat-field correction
• Advanced camera monitoring functions
• Supports 1-to-4 single-fiber configuration

Connecting Technology with Application Needs

During the exhibition, DO3THINK featured live product demonstrations, on-site presentations, livestreaming sessions, and interactive activities, offering visitors a closer look at its industrial cameras and vision inspection solutions. Through real-time demonstrations, visitors were able to see inspection results and better understand how different imaging technologies can be applied to specific production processes. The booth attracted industry professionals and potential partners, leading to in-depth discussions on practical application requirements, product performance, and technical solutions. A prize quiz and other interactive activities further enhanced the engaging atmosphere, giving visitors opportunities to interact with the DO3THINK team and explore potential applications.

At the same time, a live stream was broadcast directly from the booth. Industry professionals who are unable to attend the exhibition in person could also follow booth displays, product demonstrations, and solution presentations via the live stream.

Thank You for Connecting with DO3THINK

DO3THINK sincerely thanks everyone who visited our booth, joined our technical discussions, experienced our demonstrations, or followed our journey throughout IICIE 2026.

Although the exhibition has come to a close, the conversations and opportunities for collaboration continue.

We look forward to seeing you again at the next industry gathering!