Pre-Die-Bonding Die Inspection (PBI) Solution: Catch Defective Dies Before They Reach the Bonder

How Much Downstream Production Time Can a Single Defective Die Waste?

On packaging lines for LEDs and power chips, once a die is attached to a support or lead frame by a die bonder, it proceeds through wire bonding, dispensing or molding, baking or curing, and testing. Even a die with defects such as edge chipping, scratches, or foreign particles can go through this entire downstream process. Each step takes up machine time, production capacity and consumes materials. Lead frame, adhesive, and gold wire are all spent on a die that should be rejected before bonding. In this case, the faster the line runs, the higher the cost of this hidden waste.

That is why more production lines are moving quality control upstream, screening dies before bonding. By rejecting defective dies early, downstream processes avoid unnecessary work. Materials and machine time go toward good dies, improving downstream yield and overall efficiency.

1. Precision Imaging and Positioning to Capture Tiny Defects

To address this need, Do3think Technology introduces its Pre-Die-Bonding Die Inspection (PBI) Solution. Built around a compact split industrial camera, the solution combines an XYZ Three-Axis motion stage, a telecentric optical system, and a dedicated spot light to deliver clear images of tiny dies and accurate defect detection—adding a reliable quality control step before semiconductor packaging.

The solution pairs Do3think’s SUC500M-H3 5 MP mono split industrial camera with a 1× telecentric lens to capture fine details on tiny dies. The camera has a mono sensor to deliver high image fidelity and sharp edges. And the telecentric lens minimizes distortion and parallax for more reliable measurements of die size and spacing.

A dedicated spot light enhances contrast between the die surface and electrode regions, revealing defects such as edge chipping, scratches, and electrode abnormalities. Sufficient contrast makes defects easier to distinguish.

Built around Do3think’s industrial camera, this solution provides a stable, repeatable quality control step before packaging. It supports a wide range of dies, including LEDs and power semiconductors, and integrates readily into high-speed automated production lines.

Die Imaging Results

2. SUC500M-H3: Compact Design for Highly Integrated Inspection Systems

Key Features:

Compact Design: A sensor head measuring just 20 × 20 × 18 mm fits easily into tight spaces

Ultra-Lightweight: Weighing only 11 gss, it reduces the load on moving components

High-Speed Transmission: A USB 3.0 interface delivers up to 77 FPS, keeping pace with fast motion and high-throughput production

Low Power Consumption: Stable, reliable performance for extended continuous operation

The SUC500M-H3 split industrial camera is smaller than a coin and lighter than two coins!

This lightweight design minimizes the need for additional support on the moving assembly, allowing smoother stage acceleration and direction changes. It meets two often competing demands: installation in tight spaces and high-speed motion. With a frame rate of 77 FPS, die-by-die scanning can keep pace without slowing down to wait for images—delivering both throughput and precision.

What can it defect?

Inspection covers a wide range of defects on die surfaces and edges:

Physical Damage: Edge chipping, chipped corners, cracks, and scratches

Foreign Particles and Contamination: Surface particles, adhesive residue, and stains

Pattern Abnormalities: Electrode abnormalities, missing or misaligned patterns

Illustration of Typical Defect Types

(Not representative of any customer’s product. Actual inspection results depend on the samples tested)

Do3think’s PBI solution rethinks where quality control happens: shifting from downstream rejection to screening at the source, so every minute of machine time and every consumable goes toward good dies.

If you’re also concerned about downstream waste caused by defective dies or want to learn more about Do3think’s industrial cameras, please contact us at market@do3think.com to get more information.