Exhibition Preview | 2025 SEMI-e Shenzhen International Semiconductor Expo Opens Soon—Get an Early Look at Do3think’s Must-See Innovations!

SEMI-e Shenzhen International Semiconductor Exhibition & 2025 IC Industry Innovation Expo (hereafter “SEMI-e”) will be held from 10 to 12 September at the Shenzhen Bao’an Convention & Exhibition Center. As one of the most influential events in the semiconductor industry, this edition will gather the world’s latest semiconductor technologies and innovative applications, providing a platform for in-depth exchange and collaboration across the entire industry chain. Do3think, a pioneering innovator in industrial cameras, will showcase a range of advanced products and solutions, empowering the upgrade of smart semiconductor manufacturing.

2.5 GigE

RGS Series 25 MP Color Area Scan Camera

• Ultra-compact size and low power consumption
• 2.5GigE interface
• Compatible with 2.5G/1G/100M multi-rate speeds, with stronger adaptability
• Ideal for 3C, semiconductors, new-energy applications and more

USB 3.0

SUC Series 5 MP Mono Area Scan Camera

• Ultra-low inertia for rock-solid reliability
• Support H3 fixture installation
• Ultra-small, ultra-light design fits tight spaces across industries
• Global shutter excels at high-speed snap-shot and stop-motion inspection

1 GigE

MGV Series 20 MP Color Area Scan Camera

• Ultra-low power consumption with high stability
• Small optical size, high sensitivity
• Gigabit Ethernet supports cable runs up to 100 m
• 12 – 24 V wide-range power input
• Minimum exposure down to 1 µs for high-speed snap-shot capture

10 GigE

DSX Series 65 MP Color Area Scan Camera

• Global shutter, high sensitivity, low noise
• High bandwidth, fiber-optic long-distance transmission and better anti-interference performance
• Large optical size ultra-high resolution, outstanding image quality
• Widely deployed in PCB AOI, display, PV and other industries

2.5 GigE

DSR Series 8 k Monochrome Line Scan Camera

• Industry-first 2.5 GigE + 8 k combination
• Large pixels and high dynamic range
• Low-power design minimizes thermal noise
• Built-in large image buffer ensures reliable data transmission

Beyond static displays, Do3think will also present multiple dynamic vision solutions on-site, demonstrating innovative practices and solutions in semiconductors, PCB, 3C, new energy, film rolls, and more.

To explore more of Do3think’s innovative technologies and products, visit the Shenzhen Bao’an Convention and Exhibition Center, 16E78, from September 10th to 12th. Exciting “mystery prizes” await! We look forward to exploring the future of machine-vision inspection with you.